[{"data":1,"prerenderedAt":-1},["ShallowReactive",2],{"project-packaging-engineer":3,"similar-packaging-engineer":34},{"id":4,"slug":5,"title":6,"skills":7,"budget":19,"duration":19,"location":20,"onsitePercent":21,"contractType":22,"foundAt":23,"category":24,"description":28,"rawText":29,"webTitle":30,"webText":31,"language":32,"projectId":19,"sourceUrl":33},8630,"packaging-engineer","Packaging Engineer",[8,9,10,11,12,13,14,15,16,17,18],"Die Assembly","Bonding","Flip Chip","Wire Bonding","Optical Alignment","Fiber Attach","Optoelectronic Module Packaging","Photonic Integrated Circuits","Cleanroom Protocols","Design of Experiments","Statistical Process Control",null,"Ilhavo",100,"permanent","2026-06-03T05:21:37+00:00",{"id":25,"slug":26,"label":27},10,"electrical","Elektrotechnik & Elektronik","Highly skilled Packaging Engineer für photonics module assembly team gesucht. Verantwortlich für full lifecycle von optoelectronic module packaging, von process development bis characterization. Arbeit an der Schnittstelle von electronics, optics und precision mechanics für next-generation photonic integrated circuit modules.","\u003Cp>\u003Cstrong>Packaging Engineer\u003C\u002Fstrong>\u003C\u002Fp>\n\u003Cp> Ilhavo – Portugal (Relocation Support Available)\u003Cbr \u002F>  R&D \u002F Process Engineering\u003C\u002Fp>\n\u003Cp>\u003Cstrong>About the Role\u003C\u002Fstrong>\u003C\u002Fp>\n\u003C\u002Fp>\n\u003Cp>We are seeking a highly skilled experienced Packaging Engineer to join our photonics module assembly team. In this role, you will be responsible for the full lifecycle of optoelectronic module packaging, from process development to characterization. You will work at the intersection of electronics, optics, and precision mechanics, building next-generation photonic integrated circuit (PIC) modules for datacom and telecom next-gen applications. This is an individual contributor (IC) role with significant technical ownership and cross-functional influence. You will collaborate closely with design, test, optical and electronic engineers, and will be expected to drive continuous improvement in yield, throughput, and module performance. This is a full-time, on-site position based in Ílhavo, Portugal.\u003C\u002Fp>\n\u003C\u002Fp>\n\u003Cp>\u003Cstrong>Key Responsibilities\u003C\u002Fstrong>\u003C\u002Fp>\n\u003Cul>\n\u003Cli>Die Assembly & Bonding: Lead and optimize die bonding, flip chip (solder reflow, thermocompression, underfill), and wire\u002Fribbon bonding processes for electronic and photonic dies (laser chips, PICs, photodetectors, driver ICs) using Si, SiN, InP, and TFLN dies, with focus on process control, placement accuracy, and CTE management.\u003C\u002Fli>\n\u003Cli>Optical Alignment & Fiber Attach: Develop passive and active fiber attach processes achieving sub-micron alignment tolerances on single- and multi-mode fibers, including pigtailing, v-groove arrays, and epoxy qualification, with optical characterization of insertion loss and back-reflection.\u003C\u002Fli>\n\u003Cli>Testing: Perform mechanical integrity tests (die\u002Fwire\u002Ffiber pull and shear) and module-level optical\u002Felectrical characterization; support design of experiments (DoE), test automation, and fixture development for yield tracking.\u003C\u002Fli>\n\u003Cli>Cross-Functional & Leadership: Collaborate with design teams to embed design-for-manufacturability (DFM) and design-for-testability (DFT) principles, mentor junior engineers, and communicate process results and qualification data to several teams within the company.\u003C\u002Fli>\n\u003C\u002Ful>\n\u003Cp>\u003Cstrong> \u003C\u002Fstrong>\u003C\u002Fp>\n\u003Cp>\u003Cstrong>Your Profile\u003C\u002Fstrong>\u003C\u002Fp>\n\u003Cul>\n\u003Cli>Bachelor’s or Master’s degree in Electrical Engineering, Photonics, Materials Science, Applied Physics, Mechanical Engineering or a closely related field.\u003C\u002Fli>\n\u003Cli>5-10+ years of hands-on experience in optoelectronic or photonic module packaging in an R&D or production environment.\u003C\u002Fli>\n\u003Cli>Demonstrated expertise in at least two of: die bonding (epoxy\u002Fsolder), flip chip, wire bonding, or fiber attach\u002Foptical alignment.\u003C\u002Fli>\n\u003Cli>Experience with module-level electrical and optical characterization and test.\u003C\u002Fli>\n\u003Cli>Familiarity with cleanroom protocols, ESD handling, and semiconductor process environments.\u003C\u002Fli>\n\u003Cli>Strong understanding of optical coupling physics, waveguide fundamentals, and single-mode fiber handling.\u003C\u002Fli>\n\u003Cli>Experience with design of experiments (DoE), statistical process control (SPC), and failure analysis methodologies.\u003C\u002Fli>\n\u003C\u002Ful>\n\u003Cp>\u003Cstrong> \u003C\u002Fstrong>\u003C\u002Fp>\n\u003Cp>\u003Cstrong>Preferred Qualifications:\u003C\u002Fstrong>\u003C\u002Fp>\n\u003Cul>\n\u003Cli>Experience with hermetic packaging, encapsulated dies, or metal housing assembly.\u003C\u002Fli>\n\u003Cli>Knowledge of photonic integrated circuits (Si, SiN, InP, and TFLN platforms) and their packaging challenges.\u003C\u002Fli>\n\u003Cli>Experience with automated assembly equipment (die bonders, wire bonders, fiber attach machines, vision systems).\u003C\u002Fli>\n\u003Cli>Background in thermoelectric cooler (TEC) integration and thermal management of photonic modules.\u003C\u002Fli>\n\u003Cli>Programming skills for test automation (Python, LabVIEW, MATLAB).\u003C\u002Fli>\n\u003Cli>Experience with 3D packaging, silicon photonics interposers, or wafer-level packaging (WLP).\u003C\u002Fli>\n\u003C\u002Ful>\n\u003Cp>Darwin Recruitment is acting as an Employment Agency in relation to this vacancy.\u003C\u002Fp>\n\u003Cp>\u003Cimg src=\"https:\u002F\u002Fcounter.adcourier.com\u002FU2luZGkuTmd1YmFuZS4yODI5NS4xMjc4NEBkYXJ3aW4uYXBsaXRyYWsuY29t.gif\">\u003C\u002Fp>\n\u003Cp>\u003Cspan style=\"color: #ffffff\">Sindi Ngubane\u003C\u002Fspan>\u003C\u002Fp>\nAnsprechpartner: Sindi Ngubane\nE-Mail: Sindi.Ngubane@darwinrecruitment.com\nTelefon: +31-203-058-552","Packaging Engineer - Photonics Module Assembly","Wir suchen einen erfahrenen Packaging Engineer für unser Photonics-Modul-Assembly-Team. In dieser Position übernehmen Sie die Verantwortung für den gesamten Lebenszyklus der optoelektronischen Modulverpackung, von der Prozessentwicklung bis zur Charakterisierung. Sie arbeiten an der Schnittstelle von Elektronik, Optik und Präzisionsmechanik und entwickeln photonische integrierte Schaltkreis-Module der nächsten Generation für Datacom- und Telecom-Anwendungen.\n\nAls Individual Contributor mit erheblicher technischer Verantwortung und funktionsübergreifendem Einfluss arbeiten Sie eng mit Design-, Test-, Optik- und Elektronikingenieurinnen zusammen. Sie treiben kontinuierliche Verbesserungen in Ausbeute, Durchsatz und Modulleistung voran.\n\nIhre Hauptaufgaben umfassen die Leitung und Optimierung von Die-Bonding-, Flip-Chip- und Wire\u002FRibbon-Bonding-Prozessen für elektronische und photonische Dies. Sie entwickeln passive und aktive Faseranbindungsprozesse mit sub-mikrometer Ausrichtungstoleranz und führen mechanische Integritätstests sowie optische\u002Felektrische Charakterisierung auf Modulebene durch. Zusätzlich arbeiten Sie mit Design-Teams zusammen, um Design-for-Manufacturability-Prinzipien zu implementieren.\n\nWir erwarten einen Bachelor- oder Master-Abschluss in Elektrotechnik, Photonik, Materialwissenschaften, Angewandter Physik oder Maschinenbau sowie 5-10+ Jahre praktische Erfahrung in der optoelektronischen oder photonischen Modulverpackung. Expertise in mindestens zwei Bereichen wie Die-Bonding, Flip-Chip, Wire-Bonding oder Faseranbindung ist erforderlich. Kenntnisse in Reinraumprotokollen, ESD-Handling und Halbleiterprozessumgebungen sowie Erfahrung mit statistischer Prozesskontrolle und Failure-Analyse-Methoden runden Ihr Profil ab.","en","https:\u002F\u002Fwww.darwinrecruitment.com\u002Fjob\u002F9282952277308-pic-packaging-ilhavo-regiao-de-aveiro\u002F",{"items":35},[36,53,70,88,105,118,140,155,172,187,201,220,235,259,274],{"id":37,"slug":38,"title":39,"skills":40,"budget":49,"duration":19,"location":19,"onsitePercent":50,"contractType":22,"foundAt":51,"category":52},10387,"field-service-engineer-ups-stroomcontinuteit","Field Service Engineer UPS & Stroomcontinuïteit",[41,42,43,44,45,46,47,48],"MBO Elektrotechniek","UPS-installaties","kritische energievoorziening","elektrische installaties","VCA","NEN 3140","Nederlands","Engels","3.700 - 5.000 EUR\u002FMonat",50,"2026-06-03T06:05:04+00:00",{"id":25,"slug":26,"label":27},{"id":54,"slug":55,"title":56,"skills":57,"budget":19,"duration":19,"location":67,"onsitePercent":19,"contractType":22,"foundAt":68,"category":69},10369,"photonics-reliability-engineer","Photonics Reliability Engineer",[58,59,60,61,62,63,64,65,66],"Reliability Engineering","Photonics","Optical Communications","Semiconductor Technologies","Failure Analysis","Quality Engineering","Device Qualification","Data Analysis","Environmental Stress Testing","Eindhoven","2026-06-03T06:04:48+00:00",{"id":25,"slug":26,"label":27},{"id":71,"slug":72,"title":73,"skills":74,"budget":82,"duration":83,"location":84,"onsitePercent":21,"contractType":85,"foundAt":86,"category":87},10351,"administratief-sterke-werkvoorbereidersupervisor-e-tracing","Administratief sterke werkvoorbereider\u002Fsupervisor E-tracing",[75,76,77,78,79,80,81],"Isometric tekeningen lezen","Documentatie structureren","Werkpakketten maken","As-built informatie verwerken","SBO's opstellen","Vergunningen aanvragen","Veldcoördinatie","40 EUR\u002Fh","3 maanden","Amsterdam","contracting","2026-06-03T06:04:30+00:00",{"id":25,"slug":26,"label":27},{"id":89,"slug":90,"title":91,"skills":92,"budget":19,"duration":19,"location":19,"onsitePercent":19,"contractType":22,"foundAt":103,"category":104},9757,"senior-spacecraft-cdh-engineer","Senior Spacecraft C&DH Engineer",[93,94,95,96,97,98,99,100,101,102],"Spacecraft C&DH systems","SpaceWire","Ethernet","RS-422\u002F485","LVDS","Spacecraft electrical hardware","Avionics systems","Signal integrity","EMI\u002FEMC","FDIR strategies","2026-06-03T05:53:54+00:00",{"id":25,"slug":26,"label":27},{"id":106,"slug":107,"title":108,"skills":109,"budget":19,"duration":19,"location":19,"onsitePercent":21,"contractType":22,"foundAt":116,"category":117},9729,"elektromechanisch-onderhoudstechnieker-food-production","Elektromechanisch Onderhoudstechnieker – Food Production",[110,111,112,113,114,115,47,48],"Elektromechanica","Mechatronica","Elektrotechniek","Storingsanalyse","Onderhoudswerkzaamheden","PLC-systemen","2026-06-03T05:53:20+00:00",{"id":25,"slug":26,"label":27},{"id":119,"slug":120,"title":121,"skills":122,"budget":19,"duration":19,"location":20,"onsitePercent":19,"contractType":22,"foundAt":138,"category":139},9626,"electronic-design-automation-eda-specialist-engineer","Electronic Design Automation (EDA) Specialist Engineer",[123,124,125,126,127,128,129,130,131,132,133,134,135,136,137],"EDA Tools","Python","TCL","Bash","Perl","Cadence","Synopsys","Mentor Graphics","RTL simulations","synthesis","timing analysis","layout","DRC\u002FLVS","server infrastructure management","scripting","2026-06-03T05:51:11+00:00",{"id":25,"slug":26,"label":27},{"id":141,"slug":142,"title":143,"skills":144,"budget":19,"duration":151,"location":152,"onsitePercent":19,"contractType":85,"foundAt":153,"category":154},9605,"ingnieur-mise-en-service-lectrique","Ingénieur Mise en Service Électrique",[145,146,147,148,149,150],"Rédaction technique","Procédures d'ingénierie de projet","Communication","Santé et sécurité","Réglementations britanniques du bâtiment","Législation HSE","6 mois et plus (prolongeable)","Suisse","2026-06-03T05:45:36+00:00",{"id":25,"slug":26,"label":27},{"id":156,"slug":157,"title":158,"skills":159,"budget":19,"duration":168,"location":169,"onsitePercent":19,"contractType":85,"foundAt":170,"category":171},9593,"commissioning-engineer-electrical","Commissioning Engineer - Electrical",[160,161,162,163,164,165,166,167],"Commissioning","Electrical Systems","Project Engineering","Technical Writing","Test Procedures","Health and Safety","UK Building Regulations","Construction Health & Safety","6+ months (extendable)","Switzerland","2026-06-03T05:44:58+00:00",{"id":25,"slug":26,"label":27},{"id":173,"slug":174,"title":175,"skills":176,"budget":19,"duration":184,"location":152,"onsitePercent":19,"contractType":85,"foundAt":185,"category":186},9581,"responsable-principal-de-la-mise-en-service-lectricit","Responsable principal de la mise en service - Électricité",[177,178,179,180,181,182,183],"mise en service électrique","gestion de projet","leadership","documentation","normes H&S","génie électrique","centres de données","6 mois (prolongeable)","2026-06-03T05:44:42+00:00",{"id":25,"slug":26,"label":27},{"id":188,"slug":189,"title":190,"skills":191,"budget":19,"duration":198,"location":169,"onsitePercent":19,"contractType":85,"foundAt":199,"category":200},9533,"senior-commissioning-manager-electrical","Senior Commissioning Manager - Electrical",[192,193,179,180,194,195,196,197],"electrical commissioning","construction project management","testing procedures","UK building regulations","H&S standards","electrical engineering","6 months (extendable)","2026-06-03T05:43:33+00:00",{"id":25,"slug":26,"label":27},{"id":202,"slug":203,"title":204,"skills":205,"budget":19,"duration":19,"location":217,"onsitePercent":19,"contractType":22,"foundAt":218,"category":219},9462,"satellite-electrical-power-systems-engineer","Satellite Electrical Power Systems Engineer",[206,207,208,209,210,211,212,213,214,215,216],"spacecraft electrical systems","solar array technologies","battery technologies","power budgeting","system modelling","simulation tools","space-qualified components","thermal design","radiation design","cleanroom integration","testing","Toulouse","2026-06-03T05:42:05+00:00",{"id":25,"slug":26,"label":27},{"id":221,"slug":222,"title":223,"skills":224,"budget":230,"duration":231,"location":232,"onsitePercent":21,"contractType":85,"foundAt":233,"category":234},9185,"bms-commissioning-engineer-data-centre-project-norway-12-month-contract","BMS Commissioning Engineer – Data Centre Project – Norway – 12 Month Contract",[225,226,227,228,229],"BMS Commissioning","Tridium Niagara","HVAC","AHU","Mechanical Engineering","TBC","12+ months","Norway","2026-06-03T05:35:12+00:00",{"id":25,"slug":26,"label":27},{"id":236,"slug":237,"title":238,"skills":239,"budget":19,"duration":19,"location":19,"onsitePercent":19,"contractType":22,"foundAt":257,"category":258},9130,"senior-npu-architect","Senior NPU Architect",[240,241,242,243,244,245,246,247,248,249,250,251,252,253,254,255,256],"NPU architecture","GPU architecture","CPU architecture","ASIC design","Computer architecture","AI\u002FML workloads","Memory systems","Parallel processing","Performance optimization","Architecture definition","Performance modelling","Design trade-off analysis","Hardware\u002Fsoftware co-design","INT8","FP16","BF16","FP8","2026-06-03T05:33:50+00:00",{"id":25,"slug":26,"label":27},{"id":260,"slug":261,"title":262,"skills":263,"budget":19,"duration":19,"location":19,"onsitePercent":21,"contractType":22,"foundAt":272,"category":273},8833,"all-round-service-technician","All-round Service Technician",[264,265,266,267,268,269,270,271],"Electrical Engineering","Electrical systems","Battery and charger technology","Hand tools","VCA certification","Driving licence","Dutch language","English language","2026-06-03T05:27:04+00:00",{"id":25,"slug":26,"label":27},{"id":275,"slug":276,"title":277,"skills":278,"budget":19,"duration":19,"location":288,"onsitePercent":21,"contractType":22,"foundAt":289,"category":290},8800,"electrician-harbour-ferry-operations","Electrician – Harbour & Ferry Operations",[279,280,281,282,283,284,285,286,287],"Qualified Electrician","Electronics Technician","Industrial Electrician","electrical systems maintenance","industrial maintenance","maritime experience","German B2 level","English fluent","driving licence","Fehmarn","2026-06-03T05:26:14+00:00",{"id":25,"slug":26,"label":27}]